SII NanoTechnology Inc. (SIINT), a manufacturer of measurement and analysis instruments and a 100% subsidiary of Seiko Instruments Inc. (SII), released on December 19, 2011 the SFT9500X series, a fluorescent X-ray coating thickness gauge for micro spot measurement of metal plating and deposition. Shipments will begin in early February 2012.
gSFT9550Xh High-Performance
Fluorescent X-Ray Coating Thickness Gauge
Measurement and control of coating thickness, and composition of plated and deposited metallic thin films used in semiconductors, electronic components and printed circuit boards are critical for maintaining functionality, quality, and cost.
Miniaturization of electronic components, such as connectors and lead frames, as well as electrical devices, demands measurement of thicknesses at micro spots tens of micrometers in size of plated and deposited metallic thin films with high precision at nanometer levels.
The newly developed X-ray focusing optics (capillary) system and X-ray tube enables the SFT9500X series to achieve a high intensity beam 30 micrometers in diameter.
The SFT9500X series enables rapid and precise measurement of micro spots on
lead frames, connectors, and flexible substrates not possible with
conventional fluorescent X-ray coating thickness gauges that lack the precision due to lower irradiation intensities.
Since we released the worldfs first desktop fluorescent X-ray coating thickness gauge, our products have achieved a reputation from users world-wide for excellence in quality. The SFT9500X series was developed by SII NanoTechnology Inc. using technologies we accumulated through many years of experience.
[Key Features of SFT9500X Series]
1. Micro Spot Thickness Measurement of Thin Film and Multilayered Film
The SFT9500X series is equipped with a new capillary (X-ray focusing optic)
system and X-ray tube, irradiating at a micro spot on samples using a
focused X-ray beam 30um in diameter, but at an intensity equivalent to
conventional instruments.
The SFT9500X series lets you measure micro spots several tens of micrometers
in diameter at high measurement precisions, while simultaneously measuring
the coating thickness of each layer of multilayer applications, such as
Au/Pd/Ni/Cu.
2. Mapping Measurement
A 2D mapping image of the distribution of plating thickness and specified elements is generated by a micro beam irradiating the sample while scanning with the XY stage, resulting in quick and easy observation.
3. Contaminant Analysis
A high intensity beam combined with a high counting rate detector enables qualitative analysis of contaminants.
After the CCD camera confirms the location of contaminants, qualitative analysis (Al to U) of the contaminants can be performed by identifying differences between the spectrum obtained and a reference spectrum.
[Key Specification of SFT9500X Series]
| |
SFT9500X |
SFT9550X |
Sample Stage Size
(W x D): |
175~240 mm
|
330~420 mm
|
Sample Stage Travel
(X) x (Y) x (Z)
: |
150~220~150 mm
|
300~400~50 mm
|
Sample Measurement Size (Maximum)
(W) x (D) x (H): |
500~400~145 mm |
820~630~45 mm |
| X-ray Tube: |
Small Air-cooled X-ray tube iMax. 50kV, 1mAj |
| Detector: |
Vortex semiconductor detector (No LN2) |
| X-ray Beam Size: |
Minimum 30 micrometer in diameter |
| Sample Observation: |
CCD camera (with zoomj |
| Focus: |
Laser Pointer |
| Filter: |
Filter for Ultra-thin Au Film |
| X-ray Station: |
PC, 19 inch LDC monitor |
| Measurement Software: |
Film Analysis FP Method and Calibration Method |
| Option: |
Spectrum Matching Software, Red Signal Tower, Printer |
| Measurement Function: |
Auto Measure, Center Search |
| Data Processing: |
MicrosoftR Excel, MicrosoftR Word [statistical processing; Measurement result report of measurement data, average, maximum/ minimum, CV, Cpk, etc. (including sample image)] |
| Safety: |
Sample door interlock, diagnostic function |
Back